Trenz Electronic GmbH

MPSoC Module with AMD Zynq UltraScale+ ZU5EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm (TE0803-03-5DI21-A)

AMD/Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I, 4 GByte DDR4, 128 MByte SPI Flash, size: 5.2 x 7.6 cm


Código de artículo VAR-827003103

Número de pieza del fabricante: TE0803-03-5DI21-A

Código aduanero:


Disponible para envío inmediato: ${ $store.getters.currentItemVariation.stock.net }
Tiempo de tramitación: 3 días. Para pedidos con un valor neto total inferior a 70 euros, cobraremos unos gastos de tramitación de 15 euros.

Artículo ubicado en y enviado desde: Riedlingen, Alemania


659,91 EUR *
Contenido 1

* Sin IVA excl. Gastos de envío

This product is offered at a discount because there is already a successor.
Only valid while stocks last!

The predecessor of this article is TE0803-02-05EV-1IA. All changes are in the Product Change Notification (PCN).

The successor of this article is TE0803-04-5DI21-A. All changes are in the Product Change Notification (PCN).

The Trenz Electronic TE0803-03-5DI21-A is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ with ZU5EV, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD/Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784I
  • ZU5EV, 784 Pin Packages
  • Dimensions: 5.2 x 7.6 cm
  • Plug-on module with 4 x 160 pin B2B connectors
  • Rugged for shock and high vibration
  • 3 mm mounting holes for skyline heat spreader
  • 4 GByte 64-bit width DDR4 SDRAM
  • 128 MByte QSPI Boot Flash dual parallel
  • 2 Kbit Serial EEPROM for MAC Address
  • 48 High-density (HD) I/O's (2 banks)
  • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • User I/O
    • 65 x multi-use I/O's (MIO)
    • 156 high-performance (HP) I/O's (3 banks)
    • Serial transceiver: PS GTR 4; PL GTH 4
    • Programmable 4-channel PLL clock generator
  • All power supplies on board, single 3.3V power source required
  • Evenly spread supply pins for good signal integrity

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado ML Standard Edition (free version)

The Vivado ML Standard Edition is the FREE version of the Vivado design suite. Vivado ML Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview of all editions of Vivado ML

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0803-03-5DI21-A Trenz Electronic MPSoC module with AMD/Xilinx Zynq UltraScale+ ZU5EV

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Identificación de artículo 102651
Estado
ID de artículo histórico 3061
Modelo TE0803-03-5DI21-A
Fabricante Trenz Electronic GmbH
País de origen
Contenido 1 undefined
Peso 65 g
Peso neto 65 g